Apple iPhone 6s指紋辨識Touch ID反應速度比之前機種要快

人：蘋果（Apple）

事：iPhone 6s指紋辨識Touch ID反應速度比之前機種要快

時：2016/5

地：美國專利商標局（US Patent and Trademark Office）

物：蘋果iPhone 6和iPad Air 2，開始帶動Touch ID指紋辨識應用風潮。蘋果iPhone 6/6 Plus繼續採用電容式指紋辨識感測晶片。

摘要：

iPhone 6s的Touch ID元件，內建兩顆處理器系統，一顆處理器支援首次的匹配執行作業，這個匹配作業是測定從感測元件感測到並儲存在記憶體的手指生物辨識數據的匹配分數，若匹配分數大於第一次的門檻標準，就算匹配成功。若第一次匹配分數沒有達標時，這個Touch ID系統會啟動第二顆處理器，再次進行手指生物辨識數據匹配作業，如果匹配分數達標，就可以成功解鎖。第二次匹配作業速度比第一次匹配作業較慢，但是相對精確。第二顆處理器可以更精確地進行匹配作業，降低對使用者體驗的影響。

Note:

We find out the said patent of Apple, US 9230152 B2, being reported by news. The said patent protects electronic device and related methods for processing composite finger matching biometric data. In addition, we also find out the patent, US 8971594 B2, being owned by Authentec. The patent protects thinned finger sensor as shown as US 8971594 B2.

PS.

1.   Apple

Electronic device for processing composite finger matching biometric data and related methods
US 9230152 B2

ABSTRACT

A device may include a finger biometric sensor and a processor coupled thereto. The processor may acquire first and second finger matching biometric data based upon first and second finger placements adjacent the sensor. The processor may also perform a matching between the first and second finger matching data to generate composite finger matching data having an associated composite match score, perform another matching between the composite matching data and finger enrollment data when the composite match score exceeds a match threshold to generate an enrollment match score, and update the finger enrollment data with the composite matching data when the enrollment match score exceeds an enrollment threshold. In other embodiments, where the second finger matching data is acquired based upon a removal and replacement of the finger from adjacent the finger sensor, instead of or in addition to updating the finger enrollment data, a device function may be performed.

2. Authentec

Thinned finger sensor and associated methods
US 8971594 B2

ABSTRACT

An electronic device may include a housing with a connector member opening therein, electronic circuitry within the housing, and a finger sensor assembly carried by the housing. The finger assembly may include a thinned finger sensing integrated circuit (IC) secured to the housing that has a thickness less than 200 microns. The finger sensor assembly may also include a connector member extending through the connector member opening in the housing and coupling together the thinned finger sensing IC and the electronic circuitry. The thinned finger sensing IC may be adhesively secured to the housing, such as using a pressure sensitive adhesive, and the thinned finger sensing IC may conform to a non-planar surface.

Original Data:

http://udn.com/news/story/7098/1682985-iPhone%E6%8C%87%E7%B4%8B%E8%BE%A8%E8%AD%98%E5%B0%88%E5%88%A9-%E7%99%BC%E6%98%8E%E4%BA%BA%E7%AB%9F%E4%BE%86%E8%87%AA%E6%8D%B7%E5%85%8B